High melting point solder plating material "DAIN TINGOOD 802"
Plating is possible with relatively high current efficiency! A stable Sb content (approximately 10 wt%) coating can be obtained.
"DAIN TINGOOD 802" is a Pb-free high melting point solder plating material. It is an acidic bath (organic sulfonic acid) that does not contain fluorides, allowing for a stable Sb content (approximately 10 wt%) coating to be obtained. Plating can be performed with relatively high current efficiency. 【Usage Conditions】 ■DAIN TINGOOD 802BASE ・Concentration Condition: 900mL/L ■DAIN TINGOOD Sb-36 ・Concentration Condition: 11.5g/L ■DAIN TINGOOD S-25 ・Concentration Condition: 80g/L *For more details, please refer to the PDF document or feel free to contact us.
- Company：Daiwa Fine Chemicals Co., Ltd.
- Price：Other
